电子材料为制造半导体,显示设备,手持设备等高附加值电子产品所需的特殊化学产品。
随着此类电子产品相比以前尺寸越来越小,功能日益复杂,为了攻克产品开发的技术难题,需要不断挑战开发能够满足新型要求的材料。
例如,在从CRT到LCD,再到LED显示设备的发展中,如果没有夜景、有机半导体、发光材料等材料的开发,可能无法实现此类电子产品的生产。
主要产品及品名 | 适用领域 | 主要客户 | ||
---|---|---|---|---|
电磁屏蔽素材 (EMI1 Shielding Materials) |
导电胶液 (Gasket: FIPG2) |
GS-SG6001A | Mobile Phone Communications Equipment Consumer Electronics Military Equipment Medical Device |
Samsung Huawei Xiaomi Foxconn Huaqin Wingtech China Local Manufacturers |
GS-SG6005A | ||||
涂料 (Spray Coating) |
MS-SS4001K+ | Mobile Phone Laptop Computer Navigation System DMB System Military Equipment Wireless Charger |
||
MS-SC4001L | ||||
触控面板电极材料 (Electrode Materials for TSP3) |
丝网印刷油墨 (S/P4 Paste) |
TS-SPSV0700 | TSP | Truly O-Film China Local TSP Manufacturers |
TS-SPSV0910 | ||||
激光蚀刻膏 (L/E5 Paste) |
TS-LESV0321 | |||
TS-LESV0351 | ||||
光蚀刻膏 (P/E6 Paste) |
TS-PESV0100 | |||
薄膜开关 (M/S7 Paste) |
ME-SPCR0110 | |||
导电粘剂 (ECA8) | R&D | Portable Electric Devices | China Local Manufacturers |
|
分离胶带 (Detach Tape) | SAT-M150 | Mobile Phone | China Local Manufacturers |
|
SAT-T150 | ||||
1. EMI: Electromagnetic Interference 2. FIPG: Form In Place Gasket 3. TSP: Touch Screen Panel 4. S/P: Screen Printing |
5. L/E: Laser Etching 6. P/E: Photoetching 7. M/S: Membrane Switch 8. ECA: Electrically Conductive Adhesives |